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August 2009 |
Insights & Innovations from CyberOptics Semiconductor |
Breaking Metrology News... >> WaferSense® Airborne Particle Sensor Demonstrated at SEMICON West Did You Know? >>It's easy to test a WaferSense® device through one of our distributors in the U.S. or across the globe. Inside CyberOptics Semiconductor >> Vote for CyberOptics Semiconductor for the EuroAsia IC Industry Awards. Click HERE to vote for our WaferSense® AGS Auto Gapping System for the "Subsystems & Components Enhancement Award." >> CyberOptics Semiconductor's Production Operations Have Moved News for the Road >> Here's where we'll be next...
Sep. 30 - Oct. 2, 2009
Oct. 6 - 8, 2009 CyberOptics |
In Memoriam
Trends in Wafer Processing Technology Reports from the Fab Fab Establishes PM Schedules, Improves Die Yield by Monitoring Equipment Vibration in Real-Time The User: A 300 mm European fab for one of the world’s largest chipmakers. Getting a Handle on Equipment Vibration A 300 mm fab wanted to establish preventative maintenance (PM) schedules across its process areas, including front-end handling, vacuum chambers and vertical furnaces. They designed the PMs to detect and correct any equipment vibration that caused wafer defects and reduced die yield. Process engineers across the fab employed multiple methods to troubleshoot possible links between wafer defects and equipment vibration in reaction to wafer scratches, breaks and particle contamination. Each method of measuring vibration was inefficient and implemented only after equipment vibration had led to wafer damage. For instance, some techs at the fab used a stethoscope to listen to their equipment. Others placed an ear or hand on equipment to detect vibrations, according to Allyn Jackson, customer support manager at CyberOptics Semiconductor. Technically Speaking Using WaferSense® Auto Teaching System (ATS) on 200 mm and 300 mm TEL CLEAN TRACK ACT and Mark Tools Why Precision Calibration and Handoff Teaching is Critical on TEL CLEAN TRACK ACT and Mark Tools 1. Better resist uniformity 2. Recommended or required as part of routine PM’s 3. Required after robot, lift-pin, platen or other component replacements 4. Increased yield due to reduced particle generation with proper alignments and setups 5. Reduced scrap and wafer damage due to misalignments and mishandling 6. Required when system reports wafer placement errors 7. Necessary when troubleshooting unexplained problems such as excessive particles, unexpected tool noises, or unexplained abnormal |
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We at CyberOptics are very saddened by the recent loss of our Founder and Chairman, Dr. Steve Case. Steve was a brilliant engineer, whose many inventions and technological breakthroughs not only established the foundation for CyberOptics' success, but also helped transform the surface mount electronics industry. More importantly, Steve was a wonderful friend and colleague to everyone who worked with him. Steve established a strong and capable management team, and we will do what he would want, and that is to continue aggressively pursuing the ideas and promising opportunities he helped set in motion.