WaferSense^® Auto Gapping System 300 mm
(AGS300) Wireless Gap Measurement

Close the Gaps in Your Fabrication Process.
Our Gap Measurement Tool Improves Uniformity and Boosts Yield.

Improve uniformity and yield with wireless gap measurement system for accurate and repeatable setups.

WaferSense AGS measures gaps critical to the outcome of semiconductor processes such as thin-film deposition, sputtering and etch. This wireless system improves uniformity and increases yield through objective and repeatable gap adjustments.

Our gapping system uses three non-contact distance sensors to return live gap measurements. Measurements are then displayed in real time on your laptop or PC in numerical and graphical form, which allows you to easily make the right adjustments time after time.

Photo Gallery of WaferSense AGS300

Features

• Measures gaps at three points. Whether you need to set a gap that is perfectly level or slightly tilted, the three AGS sensors each report separate readings in numerical and graphical form to achieve exactly what you need.
• 300 mm wafer-like form factor.
• Measures gaps with ±25 micron accuracy within 4 hours of field offset calibration.
• Gap resolution ± 5 microns.
• Gapping wafer can be used in temperatures from 20°C to 70°C.
• Wireless technology means WaferSense AGS has no wires that can break after repeated use and AGS will never be misaligned by strained wires.
• GapView™ application software displays numerical and graphical information. Each graphic is color-coded to make it easier to see when the gap is above, below or within the user-defined target gap range.
• GapView lets you log time-stamped measurements to a CSV file for documentation and/or analysis.